RF thermal and new cold part design studies on a TTF-Ⅲ input coupler for Project-X

作     者：PEI Shi-Lun Chris E Adolphsen LI Zeng-Hai Nikolay A Solyak Ivan V Gonin 裴士伦;Chris E Adolphsen;李增海;Nikolay A Solyak;Ivan V Gonin

作者机构：Institute of High Energy PhysicsChinese Academy of SciencesBeijing 100049China SLAC National Accelerator LaboratoryMenlo ParkCalifornia 94025USA Fermi National Accelerator LaboratoryBatavia 60510IllinoisUSA 

出 版 物：《Chinese Physics C》 (中国物理C（英文版）)

年 卷 期：2012年第36卷第2期

页      码：173-178页

摘      要：An RF power coupler is one of the key components in a superconducting （SC） linac. It provides RF power to the SC cavity and interconnects different temperature layers （1.8 K, 4.2 K, 70 K and 300 K）. The TTF-Ⅲ coupler is one of the most promising candidates for the High Energy （HE） linac of Project X, but it cannot meet the average power requirements because of the relatively high temperature rise on the warm inner conductor, so some design modifications will be required. In this paper, we describe our simulation studies on the copper coating thickness on the warm inner conductor with RRR values of 10 and 100. Our purpose is to rebalance the dynamic and static loads, and finally lower the temperature rise along tbe warm inner conductor. In addition, to get stronger coupling, better power handling and less multipacting probability, one new cold part design was proposed using a 60 mm coaxial line; the corresponding multipacting simulation studies have also been investigated.

主 题 词：RF thermal effect TTF-Ⅲ input coupler multipacting dynamic RF power loss static thermal loss 

学科分类：08[工学] 082701[082701] 0827[工学-食品科学与工程类] 

核心收录：

D　O　I：10.1088/1674-1137/36/2/013

馆 藏 号：203101126...