Correlations between IMC thickness and three factors in Sn-3Ag-0.5Cu alloy system

作     者：孟工戈 T. Takemoto H. Nishikawa 

作者机构：College of Materials Science and Engineering Harbin University of Science and Technology Joining and Welding Research Institute Osaka UniversityIbalaki Osaka 567-0047 Japan 

出 版 物：《中国有色金属学会会刊：英文版》 (Transactions of Nonferrous Metals Society of China)

年 卷 期：2007年第17卷第4期

页      码：686-690页

摘      要：The effects of Ni content, soldering temperature and time on the IMC thickness in Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.2Co alloys were researched using uniform design method and computer programs. For each alloy, the factors were divided into three levels in the experiment. Two correlative equations are given by regression. They indicate that the effects of three factors on the function are in the mutual and quadratic forms. And the analysis of variance shows the equations are sound and meaningful. Using the equations, it is easy to search, predict and control the IMC thickness. The existence of element Co accelerates the crystallization and growing up of IMC.

主 题 词：锡银铜合金 无铅焊料 金属间化合物厚度 均匀设计 

学科分类：080503[080503] 0806[工学-电气类] 08[工学] 0818[工学-交通运输类] 0815[工学-矿业类] 0805[工学-能源动力学] 0813[工学-化工与制药类] 0703[理学-化学类] 0802[工学-机械学] 0814[工学-地质类] 0702[理学-物理学类] 080201[080201] 

核心收录：

D　O　I：10.1016/S1003-6326(07)60157-5

馆 藏 号：203103071...