Development of materials design tool and its application in Pb-free micro-solders in electronic package

作     者：OHNUMA Ikuo KAINUMA Ryosuke ISHIDA Kiyohito CHANG Austin Y. 

作者机构：Department of Materials ScienceGraduate School of EngineeringTohoku UniversitySendai 980-8579Japan Department of Materials Science and EngineeringUniversity of WisconsinMadisonUSA 

基　　金：supported by the National Natural Science Foundation of China (Grant No.50425101) the Ministry of Science and Technology,P.R.China (Grant No.2009DFA52170) the National High-Tech Research and Development Program of China ("863" Project) (Grant No.2009AA03Z101) the Ministry of Education,P.R.China (Grant No.707037) 

出 版 物：《Science China(Technological Sciences)》 (中国科学（技术科学英文版）)

年 卷 期：2010年第53卷第6期

页      码：1495-1500页

摘      要：A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements,namely,Ag,Au,Bi,Cu,In,Ni,Sb,Sn,Zn and *** can handle the calculation of phase diagrams in all combinations of these elements and all composition *** addition,based on this tool,the liquidus,solidus,phase fractions and constitutions,equilibrium and non-equilibrium solidification behavior,surface tension and viscosity of liquid,diffusion reactions and microstructural evolution,*** be *** examples of the calculation and application of this tool are *** design tool is expected to be a powerful tool for the development of Pb-free solders,as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.

主 题 词：Pb-free solders thermodynamic database calculation of phase diagram phase field method interfacial reaction 

学科分类：080901[080901] 0809[工学-计算机类] 08[工学] 

核心收录：

D　O　I：10.1007/s11431-010-3199-x

馆 藏 号：203111554...