Effect of dummy vias on interconnect temperature variation

作     者：WANG Zeng DONG Gang YANG YinTang LI JianWei 

作者机构：Key Laboratory of the Ministry of Education for Wide Band-Gap Semiconductor Materials and DevicesMicroelectronics InstituteXidian UniversityXi'an 710071China 

基　　金：supported by the National Natural Science Foundation of China (60606006) the National Science Fund for Distinguished Young Scholars of China (60725415) the Basic Science Research Fund of Xidian University 

出 版 物：《Chinese Science Bulletin》 (Chin. Sci. Bull.)

年 卷 期：2011年第56卷第21期

页      码：2286-2290页

摘      要：The number of the dummy via can significantly affect the interconnect average *** paper explores the modeling of the interconnect average temperature in the presence of multiple dummy *** proposed model incorporates the multi-via effect into the effective thermal conductivity of the interlayer dielectric (ILD) to obtain accurate *** different ILDs,the multi-via effect is analyzed and ***,the extended applications of the multi-via effect are presented in this paper to obtain the minimum interconnect average temperature increase with a given via separation or *** study suggests that the multi-via effect should be accounted for in integrated circuits design to optimize the performance and design accuracy of integrated circuits.

主 题 词：互连 温度变化 集成电路设计 平均温度 平均气温 层间绝缘 优化设计 ILD 

学科分类：080903[080903] 0809[工学-计算机类] 08[工学] 

核心收录：

D　O　I：10.1007/s11434-011-4414-2

馆 藏 号：203279531...