Heat transfer performance testing of a new type of phase change heat sink for high power light emitting diode

作     者：XIANG Jian-hua ZHANG Chun-liang ZHOU Chao LIU Gui-yun ZHOU Wei 向建化;张春良;周超;刘贵云;周伟

作者机构：School of Mechanical and Electric EngineeringGuangzhou UniversityGuangzhou 510006China Department of Mechanical and Electrical EngineeringXiamen UniversityXiamen 361005China 

基　　金：Projects(51575115 51775122)supported by the National Natural Science Foundation of China 

出 版 物：《Journal of Central South University》 (中南大学学报（英文版）)

年 卷 期：2018年第25卷第7期

页      码：1708-1716页

摘      要：In view of the limitations of solid metal heat sink in the heat dissipation of high power light emitting diode （LED）, a kind of miniaturized phase change heat sink is developed for high power LED packaging. First, the fabrication process of miniaturized phase change heat sink is investigated, upon which all parts of the heat sink are fabricated including main-body and end-cover of the heat sink, the formation of three-dimensional boiling structures at the evaporation end, the sintering of the wick, and the encapsulation of high power LED phase change heat sink. Subsequently, with the assistance of the developed testing system, heat transfer performance of the heat sink is tested under the condition of natural convection, upon which the influence of thermal load and working medium on the heat transfer performance is investigated. Finally, the heat transfer performance of the developed miniaturized phase change heat sink is compared with that of metal solid heat sink. Results show that the developed miniaturized phase change heat sink presents much better heat transfer performance over traditional metal solid heat sink, and is suitable for the packaging of high power LED.

主 题 词：miniaturized phase change heat sink three-dimensional microgrooves sintered wick heat transfer performance testing 

学科分类：08[工学] 0803[工学-仪器类] 

核心收录：

D　O　I：10.1007/s11771-018-3862-0

馆 藏 号：203308243...