Cooling Behavior in a Novel Heat Sink Based on Multilayer Staggered Honeycomb Structure

作     者：Y.L. Liu X.B. Luo W. Liu 

作者机构：School of Energy and Power Engineering Huazhong University of Science and Technology Wuhan 430074 China Department of Mechanical and Power Engineering Nanchang Institute of Technology Nanchang 330099 China 

出 版 物：《Journal of Energy and Power Engineering》 (能源与动力工程（美国大卫英文）)

年 卷 期：2010年第4卷第3期

页      码：22-28页

摘      要：A novel heatsink based on a multilayer stack of thin metal plates with staggered honeycomb cell microchannels was investigated in this paper. A series of working-parametric tests such as different heat sink pipe diameter and pumping power were conducted for the microchannel cooling system to determine the heat transfer performance under small flow rate conditions. For the double fluid flow inlets and outlets heatsink design, experimental results showed that more uniform substrate temperature distribution was obtained than the single inlet and outlet ones. It showed that the heatsink design provided a good choice for electronic chips cooling applications.

主 题 词：Multilayer honeycomb off-set fins heatsink. 

学科分类：080703[080703] 07[理学] 08[工学] 0807[工学-电子信息类] 070104[070104] 0701[理学-数学类] 

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