摘要：Thermal management of microelectronics demands higher heat flux remov.l capabilities due to the rapid increase in component and heat flux densities generated by integrated circuits (ICs). Electrospray ev.porativ. cooling (ESEC) is a potential package-lev.l thermal management solution for the next generation of microelectronics. In this paper, a design methodology is presented using numerical electrostatic field modeling to indirectly design proof-of-concept, micronozzle-based ESEC chambers. The results of the numerical modeling and heat transfer experiments indicate that the potential distribution near the micronozzle tip of the ESEC chamber dominates the heat transfer performance of ESEC cooling dev.ces. The surface charge density at the micronozzle tips has a minor impact on the heat transfer performance. The maximum enhancement ratio of 1.87 was achiev.d by the 8-nozzle ESEC chamber at the lowest heat flux inv.stigated, indicating that the heat transfer capability of ESEC chambers declines as the heat source density increases. The study demonstrates that increasing the number of micronozzles and decreasing the flow rate per nozzle may not effectiv.ly improv. the heat transfer performance of ESEC dev.ces.