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检索条件"作者=ISHIDA Kiyohito"
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Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics
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《材料与冶金学报》2005年 第2期4卷 122-125页
作者:刘兴军 OHNUMA Ikuo KAINUMA Ryosuke ishida kiyohito厦门大学 Department of Materials Science Graduate School of Engineering Tohoku University Sendai 980-8579 Japan 
Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Cal...
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Development of materials design tool and its application in Pb-free micro-solders in electronic package
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《Science China(Technological Sciences)》2010年 第6期53卷 1495-1500页
作者:OHNUMA Ikuo KAINUMA Ryosuke ishida kiyohito CHANG Austin Y.Department of Materials ScienceGraduate School of EngineeringTohoku UniversitySendai 980-8579Japan Department of Materials Science and EngineeringUniversity of WisconsinMadisonUSA 
A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the C...
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Design and development of the self-assemble Cu-Fe base composites
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《材料与冶金学报》2005年 第2期4卷 127-131页
作者:王翠萍 OHNUMA Ikuo KAINUMA Ryosuke ishida kiyohito厦门大学 Department of Materials Science Graduate School of Engineering Tohoku University Sendai 980-8579 Japan 
The Cu-Fe base alloys with liquid immiscible were prepared by gas atomization technique and conventional solidification process, the self-assemble composite microstructures in powders and bulk materials can be obtaine...
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Ni-Ti 系中γ、η、β相平衡的实验与热力学解析
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《稀有金属》1999年 第5期23卷 384-389页
作者:贾成厂 石田清仁 西泽泰二北京科技大学材料科学与工程学院北京100083 日本东北大学工学部 
采用实验和热力学解析的方法对 Ni Ti 系中γ、η、β之间的相平衡进行了研究,力图为镍基高温合金的设计和组织控制提供基础数据。γγ+ η、η+ ββ相界与文献报道一致, 但η相的存在区域有一定的成分范围, 特别是γ+...
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