摘要：To design an effective and realistically applicable sinter bonding process for power devices,we proposed a two-step process using a 200 nm Cu-particle-based paste to form a bondline having high-temperature sustainability and superior thermal *** process involved rapid pressure-assisted sinter bonding in air followed by pressureless annealing in a nitrogen *** the case of a paste prepared with a mixture of 20 wt.%malic acid and 80 wt.%ethylene glycol,sinter bonding at 300℃and 5 MPa for only 30 s resulted in a sufficient shear strength of 23.1 *** shear strength was significantly enhanced to 69.6 MPa by the additional pressureless aging for 30 ***,the two-step sinter bonding process is expected to provide an outstanding production rate as a next-generation sinter bonding process.