摘要：In semiconductor manufacturing process, prob. station that is testing equipment is important. Inspection step is for detecting defects on semiconductor b.fore the pack.ging. Prob. card is a part of prob. station and contains prob. tip that contacts to semiconductor. Through prob. tip, it can inspect defects of semiconductor. In this paper, optimization method is used with response surface analysis to design MEMS type prob. tip. And fab.icating prob. tip uses mask.ess lithography, electro-plating and lapping process.