摘要：Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multi-component system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. In addition, other related information such as the surface tension, viscosity of the liquid phase and solidification simulation can also be obtained. DICTRA (Diffusion Controlled Transformation) software was used to simulate the interfacial reactions between substrate and Pb-free solders, which can easily give the information on the growth of intermetallic compounds and moving speed of interface between substrate and solders etc.

摘要：The Cu-Fe base alloys with liquid immiscible were prepared by gas atomization technique and conventional solidification process, the self-assemble composite microstructures in powders and bulk materials can be obtained under gravity conditions, respectively, and the minor liquid phase always forms the center of composite microstructure. It is shown that the formation of the core-type macroscopic morphology is strongly connected with the existence of a stable miscibility gap of the liquid phase in the Cu-Fe base alloys. This result can be explained by a mechanism that the minor droplets as the second phase are forced to move into the thermal center due to Marangoni motion, which is caused by the temperature dependence of interfacial energy between two liquid phases.

摘要：A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements,namely,Ag,Au,Bi,Cu,In,Ni,Sb,Sn,Zn and *** can handle the calculation of phase diagrams in all combinations of these elements and all composition *** addition,based on this tool,the liquidus,solidus,phase fractions and constitutions,equilibrium and non-equilibrium solidification behavior,surface tension and viscosity of liquid,diffusion reactions and microstructural evolution,*** be *** examples of the calculation and application of this tool are *** design tool is expected to be a powerful tool for the development of Pb-free solders,as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.