摘要：Tungsten is a promising candidate for plasma-facing materials to cover the surface of the divertor plate in the design of an international thermonuclear experimental reactor （ITER）. Copper as a heat sink material serves to transfer heat excellently. Divertor mock-ups with W/Cu graded interlayers were designed to reduce thermal stresses. Thermally induced stresses and temperature in a W/Cu divertor mock-up were analyzed using the finite element method. The graded structures with different exponents p and thick- nesses were designed and discussed. The conclusions drawn from these analyses are that thermal stresses reach the minimum and the temperature is suitable when exponent p is 1.5 and the thickness of five graded interlayers is 5 mm.