摘要：In many circumst.nces,dissimilar met.ls have t. be bonded t.get.er and t.e result.ng joint.int.rfaces must.t.pically sust.in mechanical and/or elect.ical forces wit.out.failure,which is not.possible by fusion welding *** melt.ng point. of magnesium(Mg)and copper(Cu)have a significant.difference(nearly 400℃)and t.is may lead t. a large difference in t.e microst.uct.re and joint.performance of Mg-Cu ***,diffusion bonding can be used t. join t.ese alloys wit.out.much *** work analyses t.e effect.of paramet.rs on diffusion layer t.ickness,hardness and st.engt. of magnesium-copper dissimilar *** experiment. were conduct.d using t.ree-fact.r,five-level,cent.al composit. rot.t.ble design *** relat.onships were developed t. predict.diffusion layer t.ickness,hardness and st.engt. using response surface *** is found t.at.bonding t.mperat.re has predominant.effect.on bond *** fabricat.d at.a bonding t.mperat.re of 450℃, bonding pressure of 12 MPa and bonding t.me of 30 min exhibit.d maximum shear st.engt. and bonding st.engt. of 66 and 81 MPa, respect.vely.