摘要：The state-of-the-art multi-core computer systems are based on Very Large Scale three Dimensional (3D) Integrated circuits (VLSI). In order to provide high-speed vertical data transmission in such 3D systems, efficient Through-Silicon Via (TSV) technology is critically important. In this paper, various Radio Frequency (RF) TSV designs and models are proposed. Specifically, the Cu-plug TSV with surrounding ground TSVs is used as the baseline structure. For further improvement, the dielectric coaxial and novel air-gap coaxial TSVs are introduced. Using the empirical parameters of these coaxial TSVs, the simulation results are obtained demonstrating that these coaxial RF-TSVs can provide two-order higher of cut-off frequencies than the Cu-plug TSVs. Based on these new RF-TSV technologies, we propose a novel 3D multi-core computer system as well as new architectures for manipulating the interfaces between RF and baseband circuit. Taking into consideration the scaling down of IC manufacture technologies, predictions for the performance of future generations of circuits are made. With simulation results indicating energy per bit and area per bit being reduced by 7% and 11% respectively, we can conclude that the proposed method is a worthwhile guideline for the design of future multi-core computer ICs.

摘要：This paper addresses the issue of designing the detailed architectures of Field-Programmable Gate Arrays(FPGAs), which has a great impact on the overall performances of an FPGA in practice. Firstly, a novel FPGA architecture description model is proposed based on an easy-to-use file format known as YAML. This format permits the description of any detailed architecture of hard blocks and channels. Then a general algorithm of building FPGA resource graph is presented. The proposed model is scalable and capable of dealing with detailed architecture design and can be used in FPGA architecture evaluation system which is developed to enable detailed architecture design. Experimental results show that a maximum of 16.36% reduction in total wirelength and a maximum of 9.34% reduction in router effort can be obtained by making very little changes to detailed architectures, which verifies the necessity and effectiveness of the proposed model.

摘要：Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, for such RF applications. Firstly, the detailed fabrication process is described to explain how to acquire such a structure. Then, an Resistor Inductance Conductance Capacitance （RLGC） model is developed to profile the transverse electromagnetic field effect of the proposed air-gap TSV. The model is further verified by a 3D field solver program through the S-parameter comparison. With reference to the numerically simulated results, this analytical model delivers a maximum deviation of less than 6%0, on the conditions of varying diameters, outer to inner radius ratios, and SU-8 central angles, etc. Taking advantages of scalability of the model, a number of air-gap-based TSV designs are simulated, providing 1.6-4.0 times higher bandwidth than the con- ventional coaxial TSVs and leading to an efficient high frequency vertical RF interconnection solution for 3D ICs.

摘要：为提高辐照环境下振荡器工作的可靠性,提出一种交织结构的抗辐照设计加固压控振荡器(Voltage-Controlled Oscillator,VCO),该VCO由采用交织结构的延时单元构成,该延时单元支持多数表决功能,可以抑制单粒子瞬变的影响;该VCO环路中无须引入额外的专用表决模块,可以产生均匀的多相位输出。所提出的加固差分VCO是基于130 nm体硅互补金属氧化物半导体工艺设计的。模拟结果表明,所设计的加固VCO在100 fC^800 fC沉积电荷量的轰击范围内,其所产生的最大相位偏移不超过0.35 rad。

摘要：Based on the observation that both subthreshold and gate leakage depend on transistors width, this paper introduces a feasible method to fast estimate leakage current in buffers. In simulating of leakage current with swept transistor width, we found that gate leakage is not always a linear function of the device geometry. Subsequently, this paper presented the theoretical analysis and experimental evidence of this exceptional gate leakage behavior and developed a design methodology to devise a low-leakage and high-performance buffer with no penalty in area using this deviation.

摘要：安培型免疫传感器通过检测其产生的电流信号,可实现生物分子信息的检测与识别.通过对安培型免疫传感器输出信号的研究,提出了一个合理的传感器电路模型,运用多种方法对模型进行了参数提取并通过Matlab进行了验证.传感器的建模可以给信号处理电路的设计提供更好的参照,避免参数之间的冲突,同时也使得传感器可以和信号处理电路放在一起进行仿真,提高了前后端电路信号的一致性和芯片设计的成功率.

摘要：In deep sub-micron ICs, growing amounts of on-die memory and scaling effects make embedded memories more vulnerable to reliability problems, such as soft errors induced by radiation. Error Correction Code(ECC) along with scrubbing is an efficient method for protecting memories against these errors. However, the latency of coding circuits brings speed penalties in high performance applications. This paper proposed a "bit bypassing" ECC protected memory by buffering the encoded data and adding an identifying address for the input data. The proposed memory design has been fabricated on a 130 nm CMOS process. According to the measurement, the proposed scheme only gives the minimum delay overhead of 22.6%, compared with other corresponding memories. Furthermore, heavy ion testing demonstrated the single event effects performance of the proposed memory achieves error rate reductions by 42.9 to 63.3 times.

摘要：该文针对3维FPGA(3D FPGA)芯片存在的散热问题,提出具有低热梯度特征的互连网络通道结构,力图解决传统FPGA匀称互连通道设计在芯片堆叠实现上产生的温度非平衡现象。该文建立了3D FPGA的热阻网络模型;对不同类型的通道线对3D FPGA的热分布影响进行了理论分析和热仿真;提出了垂直方向通道网络非均匀分布的3D FPGA通道结构,实验表明,与给定传统FPGA互连通道结构相比,采用所提方法实现的3D FPGA设计架构能够降低76.8%的层间最高温度梯度,10.4%的层内温度梯度。

摘要：高吞吐浮点可灵活重构的快速傅里叶变换(FFT)处理器可满足尖端雷达实时成像和高精度科学计算等多种应用需求。与定点FFT相比,浮点运算复杂度更高,使得浮点型FFT的运算吞吐率与其实现面积、功耗之间的矛盾问题尤为突出。鉴于此,为降低运算复杂度,首先将大点数FFT分解成若干个小点数基2k级联子级实现,提出分别针对128/256/512/1024/2048点FFT的优化混合基算法。同时,结合所提出同时支持单通道单精度和双通道半精度两种浮点模式的新型融合加减与点乘运算单元,首次提出一款高吞吐率双模浮点可变点FFT处理器结构,并在28 nm标准CMOS工艺下进行设计并实现。实验结果表明,单通道单精度和双通道半精度浮点两种模式下的运算吞吐率和输出平均信号量化噪声比分别为3.478 GSample/s, 135 dB和6.957 GSample/s, 60 dB。归一化吞吐率面积比相比于现有其他浮点FFT实现可提高约12倍。

摘要：该文针对与非锥(And-Inverter Cone,AIC)簇架构FPGA开发中面临的簇面积过大的瓶颈问题,对其输入交叉互连设计优化进行深入研究,在评估优化流程层次,首次创新性提出装箱网表统计法对AIC簇输入和反馈资源占用情况进行分析,为设计及优化输入交叉互连结构提供指导,以更高效获得优化参数。针对输入交叉互连模块,在结构参数设计层次,首次提出将引脚输入和输出反馈连通率分离独立设计,并通过大量的实验,获得最优连通率组合。在电路设计实现层次,有效利用AIC逻辑锥电路结构特点,首次提出双相输入交叉互连电路实现。相比于已有的AIC簇结构,通过该文提出的优化方法所得的AIC簇自身面积可减小21.21%,面积制约问题得到了明显改善。在实现MCNC和VTR应用电路集时,与Altera公司的FPGA芯片Stratix IV(LUT架构)相比,采用具有该文所设计的输入交叉互连结构的AIC架构FPGA,平均面积延时积分别减小了48.49%和26.29%;与传统AIC架构FPGA相比,平均面积延时积分别减小了28.48%和28.37%,显著提升了FPGA的整体性能。