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3D狄拉克半金属(Cd_(1-x)Zn_(x))_(3)As_(2)/Sb_(2)Se_(3)背对背异质结用于超高信噪比的高速宽光谱光电探测器
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《Science China Materials》2023年 第4期66卷 1484-1493页
作者:张兴超 杨运坤 周泓希 刘贤超 潘锐 于贺 苟君 吴志明 巫江 修发贤 施毅 王军School of Optoelectronic Science and EngineeringUniversity of Electronic Science and Technology of ChinaChengdu 610054China State Key Laboratory of Surface Physics and Department of PhysicsFudan UniversityShanghai 200433China Institute of Optics and ElectronicsChinese Academy of SciencesChengdu 610200China Institute of Fundamental and Frontier SciencesUniversity of Electronic Science and Technology of ChinaChengdu 610054China National Laboratory of Solid-State MicrostructuresSchool of Electronic Science and Engineeringand Collaborative Innovation Center of Advanced MicrostructuresNanjing UniversityNanjing 210093China State Key Laboratory of Electronic Thin Films and Integrated DevicesUniversity of Electronic Science and Technology of ChinaChengdu 610054China 
三维(3D)狄拉克半金属因其独特的拓扑能带结构及优异的光电性能在中/远红外波段的宽光谱光电探测领域具有巨大的应用潜力.然而,由于较大的暗电流,构建具有高信噪比(SNR)的3D狄拉克半金属宽光谱光电探测器仍面临很大挑战.本工作基于分子...
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