摘要：通过沉淀法和热解法制备了系列MnO_(2)催化剂。X射线衍射仪(XRD)和扫描电子显微镜(SEM)表征显示Mn O2为正方晶系的针状晶体。循环伏安法、线性扫描伏安法以及电化学阻抗法的检测表明cu掺杂可影响MnO_(2)的电催化性能,相比之下,其中的cu_(0.85)-MnO_(2)有最佳的电催化析氢性能,即电流密度为10 mA·cm^(-2)时的过电位(304 mV)最低、Tafel斜率(98 mV·dec^(-1))最小、电化学活性面积(137.25)最大,界面电荷转移电阻(53.28Ω)最小。

摘要：Biomedical metals are widely used as implant materials in the human or animal body to repair organs and restore function, such as heart valves, meninges, peritoneum and artificial *** element affects the microstructure, mechanical property, corrosion resistance and wear resistance, but also influences the antibacterial and biological ***, antibacterial metal alloys have shown great potential as a new kind of biomedical materials, in which cu has been widely used as antibacterial agent *** addition, biodegradable metal alloys, including magnesium alloy and zinc alloy, also have attracted much attention *** was also used as alloying element to adjust the degradation ***, the role of cu in the alloy design will be very important for the development of new *** this paper, we summarized the recent research results on the cu-containing metal alloy for biomedical application and hoped that this review would give more suggestions for the further development of biomedical metal alloy.

摘要：采用Mishin镶嵌原子势,通过分子动力学方法模拟了金属cu的(110)表面在不同应变下的熔化行为,分析了表面熔化过程中系统结构组态和能量的变化以及固液界面迁移情况.金属cu的(110)表面在低于热力学熔点的温度下发生预熔化,准液体层的厚度随温度升高而增加.当温度高于热力学熔点时,固液界面的移动速度与温度成正比,外推得到热力学熔点为1380K,与实验结果1358K吻合良好.应变效应(包括拉伸和压缩)导致热力学熔点降低,并促进表面预熔化进程.在相同温度条件下,准液体层的厚度随应变绝对值的增加而增大.应变效应导致的固相自由能增加是金属cu(110)表面热稳定性下降的主要因素,且表面应力和应变方向的异同也会影响表面预熔化的进程.

摘要：A new concept for development of metallic biomaterials is proposed in this article, i.e., a certain bio-function can be realized for a metal implant through continuous release of a designed bio-functional metal element from surface of the metal implant in the body environment. This creative idea has been verified to be possible by several different in vitro and in vivo experimental evidences on the cu-bearing stainless steels and magnesium based metals. It was indicated that a trace amount of cu release from the cu-bearing steels could have obvious bio-functions of reduction of the in-stent restenosis （ISR）, anti-bacterial infection, inhibiting the inflammatory cells and even promoting the early osteogenesis. Furthermore, the degradation of magnesium based metals in bones could promote the new bone formation, enhance the bone mineral density for the osteoporosis modeled animal, and even have strong anti-bacterial ability and strong cytotoxicity to bone tumor cells due to the enhancement of pH. Special bio-function with satisfied load-bearing capacity for metallic biomaterials will bring higher application values for the implant made of this novel material. This is an attractive direction for research and development with many challenges, but the final success will be much beneficial to the majority of patients.

摘要：采用过渡金属cu和稀土金属Ce对TiO2进行改性。为获取高效的甲醛气体去除率,运用正交实验设计结合BP神经网络优化TiO2的改性方案。以cu-Ce掺杂负载量、cu-Ce摩尔比和烧结温度为正交实验设计因子,每个因子各取3个水平,以光催化甲醛气体的降解效率为目标因子,编制3因素4水平正交设计表。结合BP网络强大的函数拟合功能,以正交设计表中3因素为网络输入层,以光催化甲醛气体的降解效率为网络输出层,建立BP神经网络优化模型,并通过该模型进行预测和优选,得到最佳的活性炭改性方案。即cu-Ce掺杂负载量为2.92%、cu-Ce摩尔比为1∶1和烧结温度为517℃。此时光催化甲醛气体的降解效率为61.60%,与预测值59.47%的相对误差为3.46%。

摘要：cu pillar bump offers a number of advantages for flip chip packaging,compared to the conventional solder ***,due to its rigidity structure,cu pillar bump introduces a lot of stress to the chip,which causes the failure of packaging structures,especially for the advanced node devices which typically have brittle low K dielectric *** this paper,for the first time we propose two types of cu pillar structures to reduce the *** first cu pillar structure has bigger cu dimensions at the *** other one is designed to add an additional cu pad under the cu pillar *** element analysis is used to study the stress of the both structures,and it is found that with the increase in pillar bump contact area over the chip surface,the stress decreases in both *** also indicate that the cu pillar bump undercut induces higher stress,and thin cu6 Snss intermetallic compound has less impact on the stress during flip chip mount *** study provides a novel way to improve the reliability by reducing the stress in the cu pillar bump related packaging.

摘要：设计并采用Zn-Al-Ti系列钎料对cu和Al异种金属实施了钎焊,并对Zn-22Al-xTi/cu界面处的相组成和金属间化合物形貌进行了分析。结果表明:在Zn-22Al中添加0.01%至0.05%的Ti可以显著细化钎料组织,而且Zn-22Al-0.03Ti在cu基板上的铺展面积比Zn-22Al高出60.4%,但Ti的添加会提高Zn-22Al钎料的熔点和熔化区间。另外,在钎料中添加微量的Ti可以优化cu/Al接头中cu侧界面化合物的组织并减小其厚度。相比Zn-22Al钎料,Zn-22Al-0.03Ti钎焊所得cu/Al接头强度要高出13.4%,而且接头断裂位置由化合物层转移至钎料内部。X射线衍射结果显示,钎焊过程中有cuAl2,cu9Al4,cuZn 3种化合物产生于钎料与cu基板界面处。

摘要：以H2WO4和cuSO4·H2O(W:cu=70g:30g)为原料,采用化学共沉淀方法制备W-cu化合物粉末,其反应条件为:反应温度25℃±1℃,pH值5.0-5.2,陈化时间8h±1h。设计了封闭循环氢还原系统,用此系统进行氢气热还原,不仅使氢气得到充分利用,而且容易判断反应终点。通过系统内的特殊装置除水,降低了还原温度,在600℃下还原得到W和cu混合均匀的复合粉。其粒径小于70nm。

摘要：利用环境测试舱模拟室内环境,通过设计正交实验,采用"极差分析"法对制备出的一系列的cu-Ce/TiO2光催化效果进行分析。利用X射线衍射仪、扫描电镜仪和紫外-可见分光光谱仪,对微晶尺寸、晶相结构与光学性能进行分析。结果表明:cu-Ce掺杂负载量、cu-Ce摩尔比和烧结温度三因素对cu-Ce/TiO2光催化效果影响的程度相互独立,即:cu-Ce掺杂负载量>cu-Ce摩尔比>烧结温度,当A3=3%、B3=1∶1和C2=500℃,得到优方案A3B3C2。掺杂cu、Ce可以在TiO2晶体内形成锐钛型和金红石型的混晶结构,提高吸附能力,减少表面光生电子与光生空穴的复合,并且促进锐钛矿相向金红石相的转变,抑制晶粒增长,使光吸收带边发生红移。

摘要：采用Mishin嵌入原子势,通过分子动力学方法模拟了金属cu原子体系的体熔化和表面熔化行为,分析了体熔化过程中系统结构组态和能量变化以及表面熔化过程中固-液界面迁移情况.模拟结果表明:在体熔化过程中,结构组态与能量在1585K处发生突变;在表面熔化过程中,固-液界面在1380K保持静止.两种熔化过程的不同发生机制是导致体熔点1585K高于热力学熔点1380K的原因.在实际熔化中,表面熔化处于支配地位,实验测量的是热力学熔点.得到的热力学熔点与实验结果吻合良好,验证了本文所采用方法是正确和有效的,同时也说明了Mishin嵌入原子势适合处理复杂无序体系.