摘要：A new concept referred to the non-synchronous deformation effect of particle in sheet metal forming is proposed. The results of finite element analysis show that the flow resistance of sheet metal can be effectively reduced and thus the forming property can be greatly improved if the moving and deformation state of the neighboring elements with equal perpendicular distance to the entrance contour of die is non-synchronous. Experiment tests are presented and the results agree well with FEA simulation. In addition, the mechanism of the non-synchronous effect is analyzed in detail.

摘要：Solder bridge is a serious defect of solder joints in ultrafine pitch electronic device assemblies. Generation of the solder bridge is closely related to forming process of the solder joints. A three-dimensional model to simulate the formation of the solder bridge of QFP256 (quad flat packaging with 256 leads) is established and numerically calculated to predict the formation shape of the solder joints using surface evolver program. Based on the model, influence of structure of pads printed on circuit board on solder bridging is investigated. The results show that there is a critical solder volume Vc for solder joints to avoid solder bridging, and parameters of the pad size influence the critical solder volume.