摘要：Regulating chemical bonds to balance the adsorption and disassociation of water molecules on catalyst surfaces is crucial for overall water splitting in alkaline *** we report a facile strategy for designing Ni2W4C-W3C Janus structures with abundant Ni-W metallic bonds on surfaces through interfacial *** Ni atoms into the W3C crystals in reaction progress generates a new Ni2 W4C phase,making the inert W atoms in W3C be active sites in Ni2W4C for overall water *** Ni2W4CW3C/carbon nanofibers(Ni2 W4-W3C/CNFs)require overpotentials of 63 mV to reach 10 mA cm^-2 for hydrogen evolution reaction(HER)and 270 mV to reach 30 mA cm^-2 for oxygen evolution reaction(OER)in alkaline electrolyte,*** utilized as both cathode and anode in alkaline solution for overall water splitting,cell voltages of 1.55 and 1.87 V are needed to reach 10 and 100 mA cm^-2,*** functional theory(DFT)results indicate that the strong interactions between Ni and W increase the local electronic states of W *** Ni2W4C provides active sites for cleaving H-OH bonds,and the W3C facilitates the combination of Hads intermediates into H2 *** in situ electrochemical-Raman results demonstrate that the strong absorption ability for hydroxyl and water molecules and further demonstrate that W atoms are the real active sites.

摘要：A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements,namely,Ag,Au,Bi,Cu,In,Ni,Sb,Sn,Zn and *** can handle the calculation of phase diagrams in all combinations of these elements and all composition *** addition,based on this tool,the liquidus,solidus,phase fractions and constitutions,equilibrium and non-equilibrium solidification behavior,surface tension and viscosity of liquid,diffusion reactions and microstructural evolution,*** be *** examples of the calculation and application of this tool are *** design tool is expected to be a powerful tool for the development of Pb-free solders,as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.